Sekontiri sa SV Thermal Conductive Two Component 1:1 electronic pitting compound Sealant bakeng sa Junction Box
Tlhaloso ea Sehlahisoa
LIKAROLOANA
1. Ho teteana ho tlase, ho phalla hantle, ho qhalana ha lipululana ka potlako.
2. Ho kenya mocheso ka motlakase hantle le ho tsamaisa mocheso.
3. E ka ba ka hare ho dipitsa ntle le tlhahiso ya dintho tse tlase tsa dimolek'hule nakong ya ho phekolwa, e na le ho fokotseha ho hoholo haholo le ho kgomarela hantle dikarolong.
HO PHAKISA
A:B =1:1
Karolo: 25 KG
Karolo ea B: 25 KG
TŠEBELISO EA MOTHEO
1. Ho kenya dipitsa le ho se kenelle metsi bakeng sa mokhanni wa LED, di-ballast, le di-sensor tsa ho paka tse ka morao.
2. Mesebetsi ea ho kenya mocheso, ho tsamaisa mocheso, ho thibela mongobo le ho lokisa likarolo tse ling tsa elektroniki
MATLHOHO A TLWAELEHILENG
Litekanyetso tsena ha lia rereloa ho sebelisoa ha ho lokisoa litlhaloso
| THEPA | A | B | |
| Pele ho Motsoako | Ponahalo | Bosweu | Botsho |
| (25℃,65%RH) | Ho thibana ha | 2500±500 | 2500±500 |
| Botenya (25℃, g/cm³) | 1.6±0.05 | 1.6±0.05 | |
| Kamora ho Tsoakoa | Karolelano ea Tekanyo (Ka Boima) | 1 | 1 |
| (25℃,65%RH) | 'Mala | Putsoa | |
| Ho thibana ha | 2500~3500 | ||
| Nako ea Ts'ebetso (metsotso) | 40~60 | ||
| Nako ea ho Phekola (H, 25℃) | 3~4 | ||
| Nako ea ho Phekola (H, 80℃) | 10~15 | ||
| Kamora ho Phekola | Bothata (Lebopong la A) | 55±5 | |
| (25℃,65%RH) | Matla a ho Tenyetseha (Mpa) | ≥1.0 | |
| Ho tsamaisa mocheso (W/m·k) | ≥0.6~0.8 | ||
| Matla a Dielectric (KV/mm) | ≥14 | ||
| Dielectric Constant (1.2MHz) | 2.8~3.3 | ||
| Ho hanyetsa bophahamo ba modumo (Ω·cm) | ≥1.0×1015 | ||
| Koefficient ea Katoloso ea Linear (m/m·k) | ≤2.2×10-4 | ||
| Mocheso o Sebetsang (℃) | -40~100 | ||
Ngola molaetsa oa hau mona 'me u o romelle ho rona










