SV Two Component 1:1 elektroniki potting compound Sealant

SV Two Component 1:1 electronic potting compound Sealant Featured Image

Tlhaloso e Khutšoanyane:

SV electronic potting compound Sealant e etselitsoe ho pitsa le ho se kenelle metsi bakeng sa mokhanni oa LED, li-ballasts, le li-sensor tsa ho paka likoloi.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Tlhaloso ea Sehlahisoa

LIKAROLOANA

1. Viscosity e tlaase, metsi a matle, ho senyeha ha bubble ka potlako.

2. Molemo o motle oa ho kenya motlakase le ho tsamaisa mocheso.

3. E ka ba pitsa e tebileng ntle le ho hlahisa lintho tse tlaase tsa molek'hule nakong ea ho folisa, e na le ho fokotseha ho fokolang haholo le ho khomarela ka mokhoa o babatsehang ho likaroloana.

KANANELO
A:B =1:1

Karolo e 'ngoe: 25KG

B karolo: 25 KG

SEBELISA MOTHEO

1. Potting le metsi bakeng sa mokhanni LED, ballasts, le reverse parking sensors.

2. Insulation, conduction ea mocheso, ho thibela mongobo, le ho lokisa mesebetsi bakeng sa likarolo tse ling tsa elektronike

LITŠOANTŠISO TS'OANE

Litekanyetso tsena ha lia rereloa ho sebelisoa ha ho lokisoa litlhaloso

LETLOTLO	A	B
Pele ho Motsoako	Ponahalo	Bosoeu	Ntsho
(25℃,65%RH)	Viscosity	2500±500	2500±500
	Boima ba 'mele (25℃, g/cm³)	1.6±0.05	1.6±0.05
Ka mor'a ho Kopanngoa	Karo-karolelano (Ka Boima)	1	1
(25℃,65%RH)	Mmala	Hlooho
	Viscosity	2500 ~ 3500
	Nako ea Ts'ebetso (mets)	40-60
	Nako ea ho Fokotsa (H, 25℃)	3~4
	Nako ea ho Pholisa (H, 80℃)	10-15
Ka mor'a ho Koala	Ho thatafala (Lebopo A)	55±5
(25℃,65%RH)	Tensile Strength (Mpa)	≥1.0
	Thermal Conductivity (W/m·k)	≥0,6~0,8
	Matla a Dielectric (KV/mm)	≥14
	Dielectric Constant (1.2MHz)	2.8~3.3
	Ho hanyetsa Bolumo (Ω·cm)	≥1.0×1015
	Coefficient Of Linear Katoloso (m/m·k)	≤2.2×10-4
	Mocheso oa Mosebetsi (℃)	-40 ~ 100